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 Our goal is
to provide your company with exactly what
you want. This means that if
all you require is a contract manufacturer,
then that is what we provide. If you need
more, we’ve got your back.
Our production capabilities range from prototyping
and low volume production runs to high volume
production runs. We are capable of Fine Pitch
Surface Mount Technology, Ball Grid Array (BGA)
Technology, Plated-Through-Hole Technology,
and Mixed Technology.
Our production process
is pretty much just like any other company
in our field. Everyone
has to start with getting the solder on the
board, and finish with the board coming out
of the oven. The difference is in our attention
to detail. Our process includes an inspection
at every step of the way. After the solder
paste is applied, the board is visually inspected
for consistency of solder application, as
well as the accuracy of the solder application.
When the pick and place machine is finished
with the board, prior to the board conveying
into the oven, we inspect the board for any
problems. This is not to imply we have a
flawless process. We simply put every effort
forth to minimize any problems.
Upon completion
of the reflow process, the boards are taken
in racks to the Assembly
Department. At this point, the boards are
broken up into manageable batches and assigned
serial numbers as well as a batch number
for our in-house tracking purposes. In the
Assembly Department, any hand-placed parts
are installed onto the board. This includes
large caps, voltage regulators and heatsinks,
jumpers, keypads, displays, etc… Completed
batches are brought to the Technical Department
for inspection and testing. Please see the
Inspection & Testing page for more info
on this step. The last step in our production
process is a final quality check. This is
for aesthetic purposes as well as to simply
verify the product “looks right” before
it gets put into a box and sent to our client. |
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